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lite-on dcc release lite-on technology corp. / optoelectronics no.90,chien 1 road, chung ho, new taipei city 23585, taiwan, r.o.c. tel: 886-2-2222-6181 fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto through hole lamp product data sheetLTL-4262N-011A spec no.: ds20-2010-0142effective date: 12/13/2011revision: a bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4 bns-od-fc001/a4
lite - on technology corporation. p r o p e r t y o f l i t e - o n o n l y features * lead (pb) free product C rohs compliant. * ultra brightness.. * versatile mounting on p.c. board or panel. * i.c. compatible/low current requirement.. * reliable and rugged. package dimensions part no. lens source color ltl - 4262n - 011a red transparent algaas red notes: 1. all dimensions are in millimeters (inches). 2. tolerance is 0.25mm(.010") unless otherwise noted. 3. protruded resin under flange is 1.0mm(.04") max. 4. t aping process, lead length of cathode / anode different 1.0 minimum or might be same length . 5. the led lamp original is ltl - 4262n. 6 . lead spacing is measured where the leads emerge from the package. 7 . specifications are subject to change without notice. part no. : ltl - 4262n - 011a page : 1 of 11 bns - od - c131/a4
lite - on technology corporation. p r o p e r t y o f l i t e - o n o n l y absolute maximum ratings at t a =25 parameter maximum rating unit power dissipation 100 mw peak forward current (1/10 duty cycle, 0.1ms pulse width) 200 ma continuous forward current 40 ma derating linear from 50 0.5 ma/ reverse voltage 4 v operating temperature ran ge - 40 to + 100 storage temperature range - 55 to + 100 lead soldering temperature [ 2 mm(.0 787 ") from body] 260 for 5 seconds max. part no. : ltl - 4262n - 011a page : 2 of 11 bns - od - c131/a4
lite - on technology corporation. p r o p e r t y o f l i t e - o n o n l y electrical optica l characteristics at t a =25 parameter symbol min. typ. max. unit test condition luminous intensity i v 19 60 150 mcd i f = 1 0ma note 1,4 viewing angle 2 1/2 45 deg note 2 (fig.5) peak emission wavelength p 660 nm measurement @p eak (fig.1) dominant wavelength d 638 nm note 3 spectral line half - width ? 20 nm forward voltage v f 1.8 2.4 v i f = 20ma reverse current i r 100 a v r = 4v capacitance c 30 pf v f = 0 , f = 1mhz note: 1. luminous int ensity is measured with a light sensor and filter combination that approximates the cie (commission international de l'eclairage) eye - response curve. 2. 1/2 is the off - axis angle at which the luminous intensity is half the ax ial luminous intensity. 3. the dominant wavelength, d is derived from the cie chromaticity diagram and represents the single wavelength which defines the color of the device. 4. the iv guarantee should be added 15%. part no. : ltl - 4262n - 011a page : 3 of 11 bns - od - c131/a4
lite - on technology corporation. p r o p e r t y o f l i t e - o n o n l y typical electrical / optical characteristics curves (25 ambient temperature unless otherwise noted) part no. : ltl - 4262n - 011a page : 4 of 11 bns - od - c131/a4
lite - on technology corporation. p r o p e r t y o f l i t e - o n o n l y features * compatible with radial lead automatic insertion equipment. * most radial lead plastic lead lamps available packaged in tape and reel. * 5mm (0.197") formed lead and 2.54mm (0.1") straight l ead spacing available. * reel packaging simplifies handling and testing. package dimensions specification item symbol minimum maximum mm inch mm inch tape feed hole diameter d 3.8 0.149 4.2 0.165 component l ead pitch f 4.8 0.188 5.8 0.228 front to rear deflection h -- -- 2.0 0.078 height of seating plane h 15.5 0.610 16.5 0.649 feed hole to bottom of component h1 19.0 0.748 21.0 0.827 feed hole to overall component height h2 23.2 0.913 25.7 1.012 ++ lead length after component height l w0 11.0 0.433 feed hole pitch p 12.4 0.488 13.0 0.511 lead location p1 3.15 0.124 4.55 0.179 center of component location p2 5.05 0.198 7.65 0.301 total tape thickness t -- -- 0.90 0.035 feed hol e location w0 8.5 0.334 9.75 0.384 adhesive tape width w1 14.5 0.571 15.5 0.610 adhesive tape position w2 0 0 3.0 0.118 tape width w3 17.5 0.689 19.0 0.748 part no. : ltl - 4262n - 011a page : 5 of 11 bns - od - c 131/a4
lite - on technology corporation. p r o p e r t y o f l i t e - o n o n l y packing spec 3 , 000 pcs per inner carton 10 inner cartons per outer carton total 3 0 , 000 pcs per outer carton in every shipping lot, only the last pack will be non - full packing part no. : ltl - 4262 n - 011a page : 6 of 11 bns - od - c131/a4
lite - on technology corporation. p r o p e r t y o f l i t e - o n o n l y bin table specification luminous intensity unit : mcd @ 1 0ma bin code min. max. p5 19 29 p4 29 40 p3 40 60 p2 60 90 p1 90 150 note: tolerance of each bin limit is 15% part no. : ltl - 4262n - 011a page : 7 of 11 bns - od - c131/a4
lite - on technology corporation. p r o p e r t y o f l i t e - o n o n l y cautions 1. application the leds described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).consult liteons sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the leds may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices). 2. storage the storage ambient for the leds should not exceed 30c temperature or 70% relative humidity. it is recommended that l eds out of their original packaging are used within three months. for extended storage out of their original packaging, it is recommended that the leds be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient. 3. c leaning use alcohol - based cleaning solvents such as isopropyl alcohol to clean the leds if necessary. 4. lead forming & assembly during lead forming, the leads should be bent at a point at least 2 mm from the base of led lens. do not use the base of the le ad frame as a fulcrum during forming. lead forming must be done before soldering, at normal temperature. during assembly on pcb, use minimum clinch force possible to avoid excessive mechanical stress. 5. soldering when soldering, for lamp without stopper type and must be leave a minimum of 2 mm clearance from the base of the lens to the soldering point . to avoided the epoxy climb up on lead frame and was impact to non - soldering problem, dipping the lens into the solder must be avoided. do not apply any external stress to the lead frame during soldering while the led is at high temperature. recommended soldering conditions : soldering iron wave soldering temperature soldering time 3 5 0c max. 3 sec. max. (one time only) pre - heat pre - heat time solder wave soldering time 100c max. 60 sec. max. 260c max. 5 sec. max. note: excessive soldering temperature and/or time might result in deformation of the led lens or catastrophic failure of the led. ir reflow is not suitable pr ocess for through hole type led lamp product. part no. : ltl - 4262n - 011a page : 8 of 11 bns - od - c131/a4
lite - on technology corporation. p r o p e r t y o f l i t e - o n o n l y 6. drive method an led is a current - operated device. in order to ensure intensity uniformity on multiple leds c onnected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each led as shown in circuit a below. circuit model a circuit model b (a) recommended circuit (b) the brightness of each led might appear different due to the differences in the i - v characteristics of those leds 7. esd (electrostatic discharge) static electricity or power surge will damage the led. suggestions to prevent esd damage: ? use a conductive wrist band or anti - electrostatic glove when handling these leds ? all devices, equipment, and mac hinery must be properly grounded ? work tables, storage racks, etc. should be properly grounded ? use ion blower to neutralize the static charge which might have built up on surface of the leds plastic lens as a result of friction between leds during storage a nd handing part no. : ltl - 4262n - 011a page : 9 of 11 bns - od - c131/a4 led led
lite - on technology corporation. p r o p e r t y o f l i t e - o n o n l y suggested checking list : training and certification 1. everyone working in a static - safe area is esd - certified? 2. training records kept and re - c ertification dates monitored? static - safe workstation & work areas 1. static - safe workstation or work - areas have esd signs? 2. all surfaces and objects at all static - safe workstation and within 1 ft measure less than 100v? 3. all ionizer activated, positioned towards the units? 4. each work surface mats grounding is good? personnel grounding 1. every person (including visitors) handling esd sensitive (esds) items wear wrist strap, heel strap or conductive shoes with conductive flooring? 2. if c onductive footwear used, conductive flooring also present where operator stand or walk? 3. garments, hairs or anything closer than 1 ft to esd items measure less than 100v*? 4. every wrist strap or heel strap/conductive shoes checked daily and result r ecorded for all dl s ? 5. all wrist strap or heel strap checkers calibration up to date? note: *50v for blue led. device handling 1. every esds items identified by eia - 471 labels on item or packaging? 2. all esds items completely inside pro perly closed static - shielding containers when not at static - safe workstation? 3. no static charge generators (e.g. plastics) inside shielding containers with esds items? 4. all flexible conductive and dissipative package materials inspected before reus e or recycle? others 1. audit result reported to entity esd control coordinator? 2. corrective action from previous audits completed? 3. are audit records complete and on file? part no. : ltl - 4262n - 011a page : 10 of 11 bns - od - c131/a4
lite - on technology corporation. p r o p e r t y o f l i t e - o n o n l y 8 . reliability test classification test item test condition reference standard endurance test operation life ta = under room temperature if = per datasheet maximum drive current *test time = 1000 hrs ( - 24hrs, +72hrs) mil - std - 750d:1026 (1995) mil - std - 883g:1005 (2006) high temperature high humidity storage ta= 655c rh= 90 95% test time = 500hrs 2hrs. mil - std - 202g:103b (2002) jeita ed - 4701:100 103 (2001) high t emperature storage ta = 105 5 * test time = 1000 hrs ( - 24hrs, +72hrs) mil - std - 750d:1031 (1995) mil - std - 883g:1008 (2006) jeita ed - 4701:200 201 (2001) low temperature storage ta= - 55 5 *test time = 1000 hrs ( - 24hrs, +72hrs) jeita ed - 4701: 20 0 202 (2001) environmental test temperature cycling 100c ~ 25c ~ - 40c ~ 25c 30 mins 5 mins 30 mins 5 mins 50 cycles mil - std - 750d:1051 (1995) mil - std - 883g:1010 (2006) jeita ed - 4701:100 105 (2001) jesd22 - a104c (2005) thermal sho ck 100 5 ~ - 30 5 15 mins 15 mins 50 cycles < 20 secs transfer mil - std - 750d:1056 (1995) mil - std - 883g:1011 (2006) mil - std - 202g:107g (2002) jesd22 - a106b (2004) solder resistance (no pre - condition) t.sol = 260 max. dwell time = 5 sec max. 3mm from the base of the epoxy buib mil - std - 750d:2031 (1995) jeita ed - 4701: 300 302 (2001) solderability (no pre - condition) t.sol = 245 5 dwell time = 5 0.5 sec mil - std - 750d:2026 (1995) mil - std - 883g:2003 (2006) mil - std - 202g:208h (2002) ip c/eia j - std - 002 (2004) soldering iron (no pre - condition) t.sol = 350 5 dwell time = 3.5 0.5 sec mil - std - 202g:208h (2002) jeita ed - 4701: 300 302 (2001) 9. others the appearance and specifications of the product may be modified for improv ement, without prior notice. part no. : ltl - 4262n - 011a page : 1 1 of 1 1 bns - od - c131/a4

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